Product Specifications
Double-high/single-wide VMEboard
Address 32/Data 32 (A32/D32) VMEbus master (A32/D16, A24/D32, A24/D16 compatible) interface
MC68020 Microprocessor with 32-bit address and data, 25 MHz
MC68882 Floating Point Coprocessor, 25 MHz
4Mb of shared local Dynamic RAM, 32-bits wide, accessible from VHEbus
Four 28-pin JEOEC sockets for ROMs/PROMs/EPROMs/EEPROMs (in two banks, each 16-bits wide) {total 256Kb maximum)
Three 8-bit programmable timers for tick and watchdog functions
Battery backup real-time clock (MK48T02)
2040 bytes of battery backup SRAM (on the MK48T02)
Front panel asynchronous DB25 serial debug RS-232C port (on MC68901 MFP) Dual multiprotocol (synchronous/asynchronous) serial ports (Z8530)
one RS-232C (port B)one RS-485/RS-422 (port A)
VMEbus system controller functions with level 3 arbiter
Single level bus requester (level jumper selectable)
VMEbus interrupter (selectable level but with status ID $FF only) VMEbus interrupt handler for all seven levels
Front panel FAIL, HALT, RUN, and SCON status LEDs
Front panel ABORT and RESET switches
Remote reset through edge connector P2
Five-position software-readable header; part of Module Status Register (MSR)
Manufacturer by Motorola. Refurbished in good condition.
The MVME133XT is an intelligent single-board processor module containing both the MC68020 microprocessor and the MC68882 Floating Point Coprocessor (FPC) The Motorola MVME133XT VMEmodule is specified, designed, and tested to operate reliably with an incoming air temperature range from O degrees C to 55 degrees C {32 degrees to 131 degrees F) with forced air cooling at a velocity typically achievable by using a 71 CFM axial fan. Temperature qualification is performed in a standard Motorola VMEsystem 1000 chassis. Twenty-five watt load boards are inserted in two card slots, one on each side, adjacent to the board under test, to simulate a high power density system configuration. An assembly of two axial fans, rated at 71 CFM per fan, is placed directly under the VME card cage. The incoming air temperature is measured between the fan assembly and the card cage, where the incoming airstream first encounters the module under test. Test software is executed as the module is subjected to ambient temperature variations. Case temperatures of critical, high power density integrated circuits are monitored to ensure component vendors specifications are not exceeded.
SKUE11
Qty: 1
Alternative P/N #: MVME133XT, MVME 133XT, MVME-133XT, MVME133XTS, MVME 133XTS, MVME-133XTS
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